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A world without photonics?


PLASMOfab: a new era in CMOS-based PIC technology

PLASMOfab aims to develop CMOS compatible plasmonics in a generic planar integration process as the means to consolidate photonic and electronic integration. Wafer scale integration will be used by PLASMOfab to demonstrate low cost, volume manufacturing and high yield of powerful PICs.

The new integration technology will unravel a series of innovations with profound benefits of enhanced high light-matter interaction enabled by plasmonics in optical transmitters and biosensors modules.

Duration: Januray 2016 - December 2018
Horizon 2020 ICT Research and innovation programme under grant agreement No 688166.

Total budget: € 4,150,246.25
EC contribution: € 3,580,691.25

More info : - Contact:


  • Aristotle University of Thessaloniki (GR)
  • Universite de Bourgogne (F)
  • Swiss Federal Institute of Technology in Zurich (CH)
  • AMO GmbH (DE)
  • ams AG (A)
  • MicramGmbH (DE)
  • Saarland University (DE)
  • Mellanox Technologies (IL)
  • PhoeniX BV (N)
  • AIT Austrian Institute of Technology GmbH (A)


Latest article (June 2016):

"PLASMOfab’s project team reveals the plan for 2016-2019 and highlights future opportunities for upgrading communication in data centers or developing low-cost medical diagnostics (...)"

Source : Issue 1 - June 2016 PIC Magazine

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